Technical Features

•High Power Density Footprint

•High Junction Temperature (175 °C) Operation

•Low Stray Inductance (9.5 nH)

•AlSiC Baseplate

•High Thermal Conductivity Silicon Nitride Substrate

•Increased Thermal-Mechanical Performance

•3300 V Drain-Source Voltage

Typical Applications

•Heavy-Duty E-Mobility: Transportation and Mining

•Ultra-Fast DC Chargers

•Industrial Motor Drives

•Industrial Uninterruptable Power Supply (UPS) Systems

•Marine and Aerospace Propulsion

•Terrestrial Power Distribution Systems

•HVDC and FACTS Controllers