GENERAL DESCRIPTION

The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi

message voice record and playback device ideally suited to a variety of electronic systems. The

message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the

specific device.

FEATURES

Integrated message management systems for single-chip, push-button applications

o REC:level-trigger for recording

o PLAY:edge-trigger for individual message or level-trigger for looping playback sequentially

o ERASE:edge-triggered erase for first or last message or level-triggered erase for all messages

o FWD:edge-trigger to advance to the next message or fast message scan during the playback

o VOL: 8 levels output volume control

o INT RDY : ready or busy status indication

o RESET: return to the default state

o Automatic power-down after each operation cycle

Message and operation indicators

o Four customizable Sound Effects (SEs) for audible indication

o Optional vAlert (voiceAlert) to indicate the presence of new messages

o LED: stay on during recording, blink during playback, forward and erase operations

Dual operating modes

o Standalone mode:

ƒIntegrated message management techniques

Automatic power-down after each operation cycle

o SPI mode:

Fully user selectable and controllable options via APC register and various SPI commands

Two individual input channels

o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)

o AnaIn: single-ended auxiliary analog input for recording or feed-through

Dual output channels

o Differential PWM Class D speaker outputs directly drives an 8 Ωspeaker or a typical buzzer

o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier

ChipCorder standard features

o High-quality, natural voice and audio reproduction

o 2.4V to 5.5V operating voltage

o 100-year message retention (typical)

o 100,000 record cycles (typical)

Temperature options:

o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

o Industrial: -40°C to +85°C (packaged units)

Packaging types: available in die, PDIP, SOIC and TSOP

Package option: Lead-free packaged units