FEATURES

■ Access Times of 15*, 17, 20ns

■ Low Voltage Operation

■ Packaging

• 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402)

• 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint

■ Organized as 512Kx32; User Confi gurable as 1Mx16 or 2Mx8

■ Radiation Tolerant with Epitaxial Layer Die

■ Commercial and Industrial Temperature Ranges

■ 3.3V Power Supply

■ BiCMOS

■ TTL Compatible Inputs and Outputs

■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation

■ Weight

• WS512K32BV-XG2XE - 8 grams typical

• WS512K32NBV-XH2XE - 13 grams typical