FEATURES

■ Access Times 15, 17, 20, 25, 35, 45, 55ns

■ MIL-STD-883 Compliant Devices Available

■ Revolutionary, Center Power/Ground Pinout JEDEC Approved

■ 36 lead Ceramic SOJ (Package 100)

■ 36 lead Ceramic Flat Pack (Package 226)

■ Evolutionary, Corner Power/Ground Pinout JEDEC Approved

■ 32 pin Ceramic DIP (Package 300)

■ 32 lead Ceramic SOJ (Package 101)

■ 32 lead Ceramic Thinpack™ Flat Pack (Package 321)

■ 32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601)

■ Commercial, Industrial and Military Temperature Range

■ 5V Power Supply

■ Low Power CMOS

■ Low Power Data Retention for Battery Back-up Operation

■ TTL Compatible Inputs and Outputs