FEATURES

■ Access Times of 50*, 60, 70, 90, 120, 150ns

■ Packaging

• 32 lead, Hermetic Ceramic, 0.400 SOJ (Package 101)

• 32 pin, Hermetic Ceramic, 0.600 DIP (Package 300)

• 32 lead, Flatpack (Package 220)

• 32 lead, Formed Flatpack (Package 221)

• 32 pin, Rectangular Ceramic Leadless Chip

Carrier (Package 601)

■ 100,000 Erase/Program Cycles Minimum

■ Sector Erase Architecture

• 8 equal size sectors of 16KBytes each

• Any combination of sectors can be concurrently

erased. Also supports full chip erase

■ Organized as 128Kx8

■ Commercial, Industrial and Military Temperature Ranges

■ 5 Volt Programming. 5V ± 10 Supply.

■ Low Power CMOS

■ Embedded Erase and Program Algorithms

■ TTL Compatible Inputs and CMOS Outputs

■ Page Program Operation and Internal Program Control Time.