OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBHX multichip package consists of:

■ 7410E AltiVec™ RISC processor

■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72

■ 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)

■ Core frequency = 450 or 400MHz @ 1.8V

■ Maximum L2 Cache frequency = 200MHz

■ Maximum 60x Bus frequency = 100MHz

FEATURES

■ Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX

■ Implementation of Altivec™ technology instruction set

■ Optional, high-bandwidth MPX bus interface

■ HiTCE™ interposer for TCE compatibility to laminate substrates for increased Board level reliability

■ Available with eutectic or high lead solder balls