features

• High thermal conductivity on par with metallic TIMs(20 W/m-K)

• Non-evaporative materials with minimal pump out

• Nonconducting & nonreactive for use on any alloy/metal

• Ultra-low BLT

• 2.5 Year shelf life

APPLICATIONs

• Interface for semiconductors requiring low pressure or spring clamp mounting

• Thermal sensors, TEC modules, thermal wells

• IGBT’s, LED

• Power Transistors, diodes, power resistors