位置：首页 > IC中文资料第574页 > W3H32M64E-667SBC
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
W3H32M64E-667SBC | 32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） |  |   |
32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | | | |
32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | | | |
32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | | | |
32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | | | |
32Mx64DDR2SDRAM208PBGAMulti-ChipPackage 文件：231.38 Kbytes Page：6 Pages | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | | |
W3H32M64E-667SBC产品属性
- 类型
描述
- 型号
W3H32M64E-667SBC
- 制造商
Microsemi Corporation
- 功能描述
32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
WEDC |
0941+ |
BGA |
30 |
普通 |
|||
WEDC |
23+ |
BGA |
66800 |
现货正品专供军研究院 |
|||
WEDC |
21+ |
BGA |
645 |
航宇科工半导体-央企合格优秀供方! |
|||
WEDC |
专业军工 |
NA |
1000 |
只做原装正品军工级部分订货 |
|||
WHITE |
三年内 |
1983 |
纳立只做原装正品13590203865 |
||||
MICROSEMI |
22+ |
SMD |
518000 |
明嘉莱只做原装正品现货 |
|||
MSC |
2021+ |
20 |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
微芯/美高森美 |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
|||
WEDC |
23+ |
BGA |
6000 |
原装/报价当天为准 |
|||
WEDC |
1935+ |
BGA |
105 |
WEDC军工原厂渠道特供进口原装有货 |
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W3H32M64E-667SBC规格书下载地址
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DdatasheetPDF页码索引
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