Objective

This document provides general guidelines for Printed Circuit Board (PCB) design and assembly of VTIs surface mountable DIL type of Pre-molded Lead-frame packages (DIL-8 for SCA6x0 series and DIL-12 for SCA10x0 series).

It should be emphasized that this document serves only as a design guideline to help develop the optimal assembly conditions. It is essential that users also use their own manufacturing practices and experience to be able to fulfill the needs of varying end-use applications.