MECHANICAL DESCRIPTION

The Generation 5 of ADD-A-PAKTM modules combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device. The Cu baseplate allows an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improved thermal spread. The Generation 5 of AAP modules is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

FEATURES

• High voltage

• Industrial standard package

• Thick copper baseplate

• UL E78996 approved

• 3500 VRMS isolating voltage

• Totally lead (Pb)-free

• Designed and qualified for industrial level

BENEFITS

• Up to 1600 V

• Fully compatible TO-240AA

• High surge capability

• Easy mounting on heatsink

• Al203 DBC insulator

• Heatsink grounded