MECHANICAL DESCRIPTION

The AAP Gen 7 (TO-240AA), new generation of AAP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

FEATURES

• High voltage

• Industrial standard package

• Low thermal resistance

• UL approved file E78996

• Designed and qualified for industrial level

• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

BENEFITS

• Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate

• Up to 1600 V

• High surge capability

• Easy mounting on heatsink