FEATURES

• Trench IGBT technology with positive

temperature coefficient

• Square RBSOA

• 10 μs short circuit capability

• HEXFRED® antiparallel diodes with ultrasoft reverse

recovery

• TJ maximum = 150 °C

• Fully isolated package

• Very low internal inductance (5 nH typical)

• Industry standard outline

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

BENEFITS

• Designed for increased operating efficiency in power

conversion: UPS, SMPS, welding, induction heating

• Easy to assemble and parallel

• Direct mounting to heatsink

• Plug-in compatible with other SOT-227 packages

• Very low VCE(on)

• Low EMI, requires less snubbing