FEATURES

• Square RBSOA

• HEXFRED® low Qrr, low switching energy

• Positive VCE(on) temperature coefficient

• Copper baseplate

• Low stray inductance design

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

BENEFITS

• Benchmark efficiency for SMPS appreciation in particular

HF welding

• Rugged transient performance

• Low EMI, requires less snubbing

• Direct mounting to heatsink space saving

• PCB solderable terminals

• Low junction to case thermal resistance