FEATURES

• Trench IGBT technology

• FRED Pt® clamping diodes

• PressFit pins technology

• Exposed Al2O3 substrate with low thermal resistance

• Short circuit rated

• Square RBSOA

• Integrated thermistor

• Low internal inductances

• Low switching loss

• PressFit pins locking technology. Patent # US.263.820 B2

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

DESCRIPTION

VS-ETF075Y60U is an integrated solution for a multi level

inverter stage in a single package. The EMIPAK2B package

is easy to use thanks to the PressFit pins and the exposed

substrate provides improved thermal performance. The

optimized layout also helps to minimize stray parameters,

allowing for better EMI performance.