FEATURES

• Low VF

• Low profile package

• Direct mounting to heatsink

• PressFit pins technology

• Low junction to case thermal resistance

• 3500 VRMS insulation voltage

• Designed and qualified for industrial level

• PressFit pins locking technology

PATENT(S): www.vishay.com/patents

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Power conversion machines

• Welding

• UPS

• SMPS

• Motor drives

• General purpose and heavy duty application

DESCRIPTION

The new MTP module is easy to use thanks to solder less

method for contacting PressFit pins to the PCB. The low

profile package has been specifically conceived to

maximize space saving and optimize the electrical layout of

the application specific power supplies.