DESCRIPTION

This device has been designed to meet the increasing

demand for AlInGaP technology.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

LED is mounted top down and emits through the PCB.

FEATURES

• SMD LED with exceptional brightness

• Luminous intensity categorized

• Compatible with automatic placement

equipment

• EIA and ICE standard package

• Compatible with IR reflow, vapor phase

and wave solder processes according to

CECC 00802 and J-STD-020C

• Available in 12 mm tape

• Low profile package

• Non-diffused lens: excellent for coupling to light pipes and

backlighting

• Low power consumption

• Luminous intensity ratio in one packaging unit

IVmax./IVmin. > 1.6

• Preconditioning according to JEDEC® level 2

• ESD-withstand voltage: up to 2 kV according to

JESD22-A114-B

• AEC-Q101 qualified

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912