FEATURES

• Ultra compact LLP1006-2L package

• Low package height < 0.4 mm

• 1-line ESD protection

• Low leakage current < 0.2 μA

• Low load capacitance CD = 38 pF

(VR = 2.5 V; f = 1 MHz)

• ESD immunity acc. IEC 61000-4-2

± 30 kV contact discharge

± 30 kV air discharge

• High surge current acc. IEC 61000-4-5 IPP > 8 A

• Soldering can be checked by standard vision inspection.

No X-ray necessary

• Pin plating NiPdAu (e4) no whisker growth

• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)

• PATENT(S): www.vishay.com/patents

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912