FEATURES

• Ultra compact LLP1006-2M package

• Low package height < 0.4 mm

• 1-line ESD protection

• Working range ± 5.5 V

• Low leakage current IR < 0.1 μA

• Very low load capacitance CD = 0.3 pF

• ESD immunity acc. IEC 61000-4-2

± 15 kV contact discharge

± 16 kV air discharge

• Soldering can be checked by standard vision inspection;

no X-ray necessary

• Pin plating NiPdAu (e4) no whisker growth

• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)

• PATENT(S): www.vishay.com/patents

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912