FEATURES

• Oxide planar chip junction

• Ultrafast recovery time

• Soft recovery characteristics

• Low switching losses, high efficiency

• High forward surge capability

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in high voltage continuous mode power factor correctors (CCM PFC), switching mode power supplies, freewheeling diodes and secondary dc-to-dc rectification application.