FEATURES

• Glass passivated chip junction

• Ultrafast recovery times

• Soft recovery charateristics

• Low switching losses, high efficiency

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum

peak of 245 °C (for TO-263AB package)

• Solder dip 260 °C, 40 s (for TO-220AC and

ITO-220AC package)

• Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in high voltage, high frequency power factor

correctors, switching mode power supplies,

freewheeling diodes and secondary dc-to-dc

rectification application.