FEATURES

• Glass passivated chip junction

• Ultrafast reverse recovery time

• Soft recovery characteristics

• Low forward voltage drop

• Low switching losses, high efficiency

• High forward surge capability

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS

  For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.