FEATURES

• Hyperfast and soft recovery characteristic

• Electrically isolated base plate

• Simplified mechanical designs, rapid assembly

• High operation junction temperature (TJ max. = 175 °C)

• Designed and qualified for industrial and consumer level

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

DESCRIPTION

The semiconductor in the SOT-227 package is isolated from

the copper base plate, allowing for common heatsinks and

compact assemblies to be built.