DESCRIPTION

TSMF1000 series are infrared, 890 nm emitting diodes

based on surface emitter chip technology with high radiant

power and high speed, molded in clear, untinted plastic

packages (with lens) for surface mounting (SMD).

FEATURES

• Package type: surface-mount

• Package form: GW, RGW, yoke

• Dimensions (L x W x H in mm): 2.5 x 2 x 2.7

• Peak wavelength: λp = 890 nm

• High radiant power

• Angle of half intensity: ϕ = ± 11°

• Low forward voltage

• Suitable for high pulse current operation

• Package matches with detector TEMD1000

• Floor life: 168 h, MSL 3, according to J-STD-020

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912