Features

• Plastic package has Underwriters Laboratory Flammability Classification 94V-0

• Ideal for automated placement

• Low profile package

• Built-in strain relief

• Exclusive patented PAR® oxide passivated chip construction

• 400W peak pulse power capability with a 10/1000ms waveform, repetition rate (duty cycle): 0.01

• Excellent clamping capability

• Low incremental surge resistance

• Very fast response time

• For devices with V(BR) ≥ 10V ID are typically less than 1.0mA at TA = 150°C

• Designed for under the hood surface mount applications

• High temperature soldering: 250°C/10 seconds at terminals