FEATURES

• Low profile package

• Ideal for automated placement

• Glass passivated chip junction

• Low Zener impedance

• Low regulation factor

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

   For general purpose regulation and protection applications.