FEATURES

• Very low profile - typical height of 1.0 mm

• Ideal for automated placement

• Available in uni-directional

• 400 W peak pulse power capability with a 10/1000 µs waveform

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Meets MSL level 1, per J-STD-020

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC