FEATURES

• Low profile package

• Ideal for automated placement

• Guardring for overvoltage protection

• Low power losses, high efficiency

• Very low forward voltage drop

• High surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

  For use in low voltage high frequency inverters, freewheeling, dc-to-dc converters, and polarity protection applications.