FEATURES

• For surface mounted applications

• Low-profile package

• Ideal for automated placement

• Low power loss, high efficiency

• Oxide planar chip junction

• Meets MSL level 1, per J-STD-020, LF maximum

peak of 260 °C

• Meets JESD 201 class 2 whisker test

• Wave and reflow solderable

• AEC-Q101 qualified

• Compatible to SOD-123W package case outline or

SOD-123F and SOD-123FL

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912