DESCRIPTION

Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The D2PAK (TO-263) is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK (TO-263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2 W in a typical surface mount application.

FEATURES

• Surface Mount

• Available in Tape and Reel

• Dynamic dV/dt Rating

• P-Channel

• Fast Switching

• Ease of Paralleling

• Simple Drive Requirements

• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912