FEATURES

• Flat chip contacted top and bottom

(NTCC201E4 series)

• Green thermistor - does not use RoHS

exemptions

• Wide temperature range from -55 °C to +175 °C

(resistant to repetitive short periods at 200 °C,

as for example, 10 times 10 s)

• Highly resistant to mounting conditions

• Ideal for aluminum wire

• Resistance to leaching during reflow soldering

process

• Delivered on blister tape

• AEC-Q200 qualified

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• High temperature sensing, control and compensation in

power semiconductor modules (e.g. IGBT, MOSFET,

Diodes, …), inverters in EV/HEV vehicles, and windmills

• IC and semiconductor protecting

• DC/AC power inverters and HIC overheat protecting

DESIGN-IN SUPPORT

For complete curve computation, please visit:

www.vishay.com/thermistors/ntc-curve-list/

MARKING

The thermistors have no marking and have electrode

termination design without orientation.

Wire bonding:

• The silver electrode has been tested for aluminum wire

bonding with a wire diameter of max. 300 μm

Encapsulation:

• In order to preserve the characteristics of the bonded die

at long term an encapsulation is mandatory

• The encapsulation is defined by the user. Silicon and

epoxy encapsulations have been tested. For

recommendations on compatible encapsulants contact

Vishay