FEATURES

• Glass passivated chip junction

• Low forward voltage drop

• Low leakage current, typical IR less than 0.1 μA

• High forward surge capability

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• AEC-Q101 qualified

• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

    For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes application.