FEATURES

• Glass passivated chip junction

• 1500 W peak pulse power capability with a

   10/1000 µs waveform, repetitive rate (duty

   cycle): 0.01 %

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC

   and WEEE 2002/96/EC

TYPICAL APPLICATIONS

   Use in sensitive electronics protection against voltage

   transients induced by inductive load switching

   and lighting on ICs, MOSFET, signal lines of sensor

   units for consumer, computer, industrial and

   telecommunication.