FEATURES

• Advanced process technology

• Surface-mount (IRFZ44S, SiHFZ44S)

• Low-profile through-hole (IRFZ44L, SiHFZ44L)

• 175 °C operating temperature

• Fast switching

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

Note

* This datasheet provides information about parts that are

RoHS-compliant and / or parts that are non RoHS-compliant. For

example, parts with lead (Pb) terminations are not RoHS-compliant.

Please see the information / tables in this datasheet for details

DESCRIPTION

Third generation power MOSFETs from Vishay utilize

advanced processing techniques to achieve extermely low

on resistance per silicon area. This benefit, combined with

the fast switching speed and ruggedized device design that

power MOSFETs are well known for, provides the designer

with an extermely efficient reliabel deviece for use in a wide

variety of applications.

The D2PAK is a surface-mount power package capable of

accommodating die sizes up to HEX-4. It provides the

highest power capability and lowest possible on-resistance

in any existing surface mount package. The D2PAK is

suitable for high current applications because of its low

internal connection resistance and can dissipate up to 2.0 W

in a typical surface mount application.

The through-hole version (IRFZ44L, SiHFZ44L) is available

for low profile applications.