MECHANICAL SPECIFICATIONS

Solderability: 90 % coverage after 5 s dip in 235 °C solder

following 60 s preheat at 120 °C to 150 °C and type R flux dip

Resistance to Solder Heat: 10 s in 260 °C solder, after

preheat and flux per above

Terminal Strength: 0.6 kg (1.32 lbs) minimum for 30 s

Beam Strength: 1 kg (2.2 lbs) minimum

Flex: 0.079 [2 mm] min. mounted on 0.063 [1.6 mm] thick

PC board

FEATURES

• High reliability

• Surface mountable

• Magnetically self shielded

• Nickel barrier plating virtually eliminates silver

migration

• Compliant to RoHS Directive 2002/95/EC

• Halogen-free according to IEC 61249-2-21 def

ENVIRONMENTAL SPECIFICATIONS

Operating Temperature: - 55 °C to + 125 °C

Thermal Shock: 100 cycles, - 40 °C to + 125 °C

Biased Humidity: 85 % RH at 85 °C, 1000 h at full rated

current