FEATURES

• Lowest molded height (3.0 mm) in this package footprint

• Shielded construction

• Excellent DC/DC energy storage up to 5 MHz. Filter

inductor applications up to SRF (see “Standard Electrical

Specifications” table)

• Lowest DCR/μH, in this package size

• Handles high transient current spikes without saturation

• Ultra low buzz noise, due to composite construction

• Tin/Lead Sn/Pb plated (not dipped) terminals

• Encapsulated body offers improved environmental

protection and moisture resistance

• Higher dielectric withstanding voltage vs IHLP

• Flame retardant encapsulant (UL 94V-0)

• Corrosion resistant package

• IHLP design. PATENT(S): www.vishay.com/patents

APPLICATIONS

• PDA / notebook / desktop / server applications

• High current POL converters

• Low profile, high current power supplies

• Battery powered devices

• DC/DC converters in distributed power systems

• DC/DC converter for field programmable gate array

(FPGA)

• Harsh environments including moisture, chemicals and

salt spray