FEATURES

• Lowest molded height (3.0 mm) in this package

footprint

• Shielded construction

• Excellent DC/DC energy storage up to 5 MHz.

Filter inductor applications up to SRF (see

“Standard Electrical Specifications” table)

• Lowest DCR/μH, in this package size

• Handles high transient current spikes without saturation

• Ultra low buzz noise, due to composite construction

• Encapsulated body offers improved environmental

protection and moisture resistance

• Higher dielectric withstanding voltage vs. IHLP

• Flame retardant encapsulant (UL 94 V-0)

• Corrosion resistant package

• IHLP design. PATENT(S): www.vishay.com/patents

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• PDA / notebook / desktop / server applications

• High current POL converters

• Low profile, high current power supplies

• Battery powered devices

• DC/DC converters in distributed power systems

• DC/DC converter for Field Programmable Gate Array

(FPGA)

• Harsh environments including moisture, chemicals and

salt spray