FEATURES

• Glass passivated chip junction

• Low forward voltage drop

• Low leakage current, typical IR less than 0.1 μA

• High forward surge capability

• Meets environmental standard MIL-S-19500

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• Compliant to RoHS directive 2002/95/EC and in

   accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS

   For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.