FEATURES

• Glass passivated chip junction

• Ultrafast recovery time

• Low switching losses, high efficiency

• Low leakage current

• High forward surge capability

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

    For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.