FEATURES

• Ultra low VF to footprint area

• Very low profile (< 0.6 mm)

• Low thermal resistance

• Supplied tested and on tape and reel

APPLICATIONS

• Reverse polarity protection

• Current steering

• Freewheeling

• Flyback

• Oring

DESCRIPTION

Vishay's FlipKY® product family utilizes wafer level

chip scale packaging to deliver Schottky diodes with the

lowest VF to PCB footprint area in industry. The three pad

0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy

only 1.08 mm2 of board space. The anode and cathode

connections are made through solder bump pads on one

side of the silicon enabling designers to strategically place

the diodes on the PCB. This design not only minimizes board

space but also reduces thermal resistance and inductance,

which can improve overall circuit efficiency.

Typical applications include hand-held, portable equipment

such as cell phones, MP3 players, bluetooth, GPS, PDAs,

and portable hard disk drives where space savings and

performance are crucial.