FEATURES

• For surface mounted applications

• Low profile package

• Ideal for automated placement

• Glass passivated pellet chip junction

• Meets MSL level 1, per J-STD-020, LF maximum

peak of 260 °C

• Meets JESD 201 class 2 whisker test

• Wave and reflow solderable

• AEC-Q101 qualified

• Compatible to SOD-123W package case outline or

SOD-123F and SOD-123FL

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

MECHANICAL DATA

Case: SMF (DO-219AB)

Polarity: band denotes cathode end

Weight: approx. 15 mg

Packaging codes / options:

GS18/10K per 13 reel (8 mm tape)

GS08/3K per 7 reel (8 mm tape)

Circuit configuration: single