FEATURES

• Glass passivated chip junction

• High breakdown voltage capability

• Very fast reverse recovery time

• Fast forward recovery time

• High efficiency, low switching losses

• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)

• Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)

• Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS

    For use in high resolution display TV and monitor horizontal deflection application.