FEATURES

• Stability R/R = 1 for 1000 h at 70 ° C

• 2 mm pitch packaging option for 0603 size

• Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes

• Metal glaze on high quality ceramic

• AEC-Q200 qualified

• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912