FEATURES

• Low profile package

• Ideal for automated placement

• Glass passivated junction

• Low reverse current

• Soft recovery characteristics

• Ultrafast reverse recovery time

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

  For use in high frequency rectification of power supply, inverters, converters and freewheeling diodes for consumer, automotive and telecommunication.