FEATURES

• Superectifier structure for high reliability application

• Cavity-free glass-passivated junction

• Low forward voltage drop

• Low leakage current, IR less than 0.1 µA

• High forward surge capability

• Meets environmental standard MIL-S-19500

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

    For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.