FEATURES

• Low profile package

• Ideal for automated placement

• Glass passivated chip junction

• Available in Unidirectional and Bidirectional

• 600 W peak pulse power capability with a

10/1000 µs waveform, repetitive rate (duty cycle):

0.01

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Meets MSL level 1, per J-STD-020C, LF max peak

of 260 °C

• Solder Dip 260 °C, 40 seconds

• Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

TYPICAL APPLICATIONS

Use in sensitive electronics protection against voltage

transients induced by inductive load switching and

lighting on ICs, MOSFET, signal lines of sensor units

for consumer, computer, industrial, automotive and

telecommunication.