Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

ADD-A-pak-TM GEN V Power Modules

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Power Bridge Rectifiers

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Power Bridge Rectifiers

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3~phase

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