HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

封装/外壳：INT-A-PAK（2） 包装：散装 描述：DIODE GP 1.2KV 375A INTAPAK 分立半导体产品 二极管 - 整流器 - 单

MF-PSML/X Series - Low Ohmic PTC Resettable Fuses

Features Ultra-low resistance, quick response 0805 footprint size and low profile for spaceconstrained mobile applications Surface mount packaging for automated assembly RoHS compliant* and halogen free** Agency recognition

Line Thyristor

Features • Hermetic metal case with glass insulator • Threaded stud ISO M24x1,5 or UNF 3/4-16 • High i2t and ITSM values for easy fusing • International standard case

Low Ohmic PTC Resettable Fuses

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