IGBT Fourpack Module, 50 A

FEATURES • Trench gate field stop IGBT • Square RBSOA • HEXFRED® low Qrr, low switching energy • Positive VCE(on) temperature coefficient • Copper baseplate • Low stray inductance design • Designed and qualified for industrial market • Material categorization: for definitions of compliance

IGBT Fourpack Module, 50 A

FEATURES • Trench gate field stop IGBT • Square RBSOA • HEXFRED® low Qrr, low switching energy • Positive VCE(on) temperature coefficient • Copper baseplate • Low stray inductance design • Designed and qualified for industrial market • Material categorization: for definitions of compliance

封装/外壳：模块 包装：托盘 描述：ECONO - 4 PACK IGBT 分立半导体产品 晶体管 - IGBT - 模块

IGBT Fourpack Module, 50 A

FEATURES • Trench gate field stop IGBT • Square RBSOA • HEXFRED® low Qrr, low switching energy • Positive VCE(on) temperature coefficient • Copper baseplate • Low stray inductance design • Designed and qualified for industrial market • Material categorization: for definitions of compliance

IGBT Fourpack Module, 50 A

FEATURES • Square RBSOA • HEXFRED® low Qrr, low switching energy • Positive VCE(on) temperature coefficient • Copper baseplate • Low stray inductance design • Designed and qualified for industrial market • UL approved file E78996 • Material categorization: for definitions of compliance ple

IGBT Fourpack Module, 50 A

FEATURES • Square RBSOA • HEXFRED® low Qrr, low switching energy • Positive VCE(on) temperature coefficient • Copper baseplate • Low stray inductance design • Designed and qualified for industrial market • UL approved file E78996 • Material categorization: for definitions of compliance ple