Surface-Mount TMBS짰 (Trench MOS Barrier Schottky) Rectifiers

FEATURES • Trench MOS Schottky technology • Low profile package • Ideal for automated placement • Low forward voltage drop, low power losses • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Wave and reflow solderable • AEC-Q101 qualified available - Automotive ordering code

Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifiers

Trench MOS Schottky technology\nLow profile package\nIdeal for automated placement;

Surface-Mount TMBS짰 (Trench MOS Barrier Schottky) Rectifiers

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Surface-Mount TMBS짰 (Trench MOS Barrier Schottky) Rectifiers

FEATURES • Trench MOS Schottky technology • Low profile package • Ideal for automated placement • Low forward voltage drop, low power losses • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Wave and reflow solderable • AEC-Q101 qualified available - Automotive ordering code

封装/外壳：DO-219AB 包装：卷带（TR） 描述：1A 45V SMF TRENCH SKY RECT 分立半导体产品 二极管 - 整流器 - 单

封装/外壳：DO-219AB 包装：卷带（TR）剪切带（CT） 描述：1A 45V SMF TRENCH SKY RECT 分立半导体产品 二极管 - 整流器 - 单