Features

Glass passivated junction .

Excellent clamping capability .

Repetitive rate (duty cycle):0.01 .

Low profile package and low inductance .

3000A Peak Pulse power capability at 8/20us waveform .

Fast response time: typically less than 1.0ps from 0V to VBR min .

High temperature soldering:260℃/10s at terminals .

For surface mounted application in order to optimize board space .

Plastic package has Underwriters Laboratory Flammability 94V-0 .

Halogen free and RoHS compliant .